MC54HC563 |
RFQ for MC54HC563 Required Field |
 |
| Product | Manufacturers | Pack | D/C |
| MC54HC563 | - | - | - |
Features |
| * Output Drive Capability: 15 LSTTL Loads* Outputs Directly Interface to CMOS, NMOS, and TTL* Operating Voltage Range: 2 to 6 V* Low Input Current: 1 A* High Noise Immunity Characteristic of CMOS Devices* In Compliance with the Requirements Defined by JEDEC Standard No. 7A* Chip Complexity: 202 FETs or 50.5 Equivalent Gates |
| Symbol | Parameter | Value | Unit |
| VCC | DC Supply Voltage (Referenced to GND) | 0.5 to + 7.0 | V |
| Vin | DC Input Voltage (Referenced to GND) | 1.5 to VCC + 1.5 | V |
| Vout | DC Output Voltage (Referenced to GND) | 0.5 to VCC + 0.5 | V |
| Iin | DC Input Current, per Pin | ±20 | mA |
| Iout | DC Output Current, per Pin | ±35 | mA |
| ICC | DC Supply Current, VCC and GND Pins | ±75 | mA |
| PD | Power Dissipation in Still Air,Plastic or Ceramic DIP+ SOIC Package+ |
750 500 |
mW |
Tstg |
torage Temperature |
65 to + 150 |
oC |
| TL | Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package)(Ceramic DIP) |
|
oC |
